Wetting Optimized Solutions for Plasma Etch Residue Removal for Application in Interconnect Systems of Integrated Circuits

In multi-level Co/low-k based interconnect systems of ultralarge-scale integrated electronic devices the removal of plasma etch residues by common plasma cleaning processes has been shown to alter material properties like k-value and leakage current of the low-k dielectric. Besides the... Ausführliche Beschreibung

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Format: E-Book
veröffentlicht: Chemnitz: Universitätsbibliothek Chemnitz, 2013
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