Electronic Transport in Metallic Carbon Nanotubes with Metal Contacts

The continuous migration to smaller feature sizes puts high demands on materials and technologies for future ultra-large-scale integrated circuits. Particularly, the copper-based interconnect system will reach fundamental limits soon. Their outstanding properties make metallic carbon nanotubes... Ausführliche Beschreibung

1. Verfasser:
Weitere Verfasser: [advisor] ; [advisor] ; [referee]
Format: Elektronische Hochschulschrift
veröffentlicht: Chemnitz : Universitätsbibliothek Chemnitz, 2013.
Schlagworte:
Kein Bild verfügbar
Gespeichert in: