Wetting Optimized Solutions for Plasma Etch Residue Removal for Application in Interconnect Systems of Integrated Circuits : Benetzungsoptimierte Reinigungslösungen für die Entfernung von Plasmaätzresiduen für die Anwendung im Verdrahtungssystem integrierter Schaltungen

In multi-level Co/low-k based interconnect systems of ultralarge-scale integrated electronic devices the removal of plasma etch residues by common plasma cleaning processes has been shown to alter material properties like k-value and leakage current of the low-k dielectric. Besides the... Ausführliche Beschreibung