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Organosilane Downstream Plasma On Ultra Low-k Dielectrics: Comparing Repair With Post Etch Treatment Organosilane Downstream Plasma On Ultra Low-k Dielectrics:Comparing Repair With Post Etch Treatment AMC 2015 – Advanced Metallization Conference

Bibliographic Details
Authors and Corporations: Calvo, Jesús, Steinke, Philipp, Wislicenus, Marcus, Gerlich, Lukas, Seidel, Robert, Clauss, Ellen, Uhlig, Benjamin
Title Statement: Organosilane Downstream Plasma On Ultra Low-k Dielectrics: Comparing Repair With Post Etch Treatment AMC 2015 – Advanced Metallization Conference Organosilane Downstream Plasma On Ultra Low-k Dielectrics:Comparing Repair With Post Etch Treatment
Type of Resource: E-Article
published:
Universitätsbibliothek Chemnitz 2016
Series: AMC 2015 – Advanced Metallization Conference
Subjects: