Organosilane Downstream Plasma On Ultra Low-k Dielectrics: Comparing Repair With Post Etch Treatment : Organosilane Downstream Plasma On Ultra Low-k Dielectrics:Comparing Repair With Post Etch Treatment, AMC 2015 – Advanced Metallization Conference

Plasma induced damage of ultra low-k (ULK) dielectrics is a common phenomenon in BEOL interconnects. The damage leads to an increase in k-value, which raises the RC delay, leading to increased power consumption and cross talk noise. Therefore, diverse repair and post etch treatments (PET) have... Ausführliche Beschreibung

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veröffentlicht: Universitätsbibliothek Chemnitz, 2016
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